Internship / Thesis in Process Engineering, Location: Erfurt/Germany
X-FAB Sarawak
Datum: vor 2 Tagen
Stadt: Erfurt, Thüringen
Vertragstyp: Praktikum
Erfurt, Germany
Start your career in the semiconductor industry now. As an international microchip manufacturer from Erfurt, we offer you future-oriented topics and responsible tasks. With 45 nations on 3 continents, we rely on specialized knowledge in microchip manufacturing. Become part of our X-FABulous team!
Your Role
Would you like to complete a (mandatory) internship in a technical environment or do you need support with your thesis (Bachelor, Master)?
X-FAB's process engineering team in Erfurt/Germany will be the right place for you:
Topic 1: RIE nitride process optimization
During pore etching, holes are etched into the nitride membrane. The etching must stop on the underlying oxide. If the oxide is over-etched, it is no longer possible to process the wafer further and the wafer is scrapped.
The existing process is to be optimized in a series of tests.
The processor is to determine the remaining nitride/oxide thickness and the etching dimension with various parameter changes on some test wafers in order to evaluate his experiments.
Goal
You are an enrolled student (m/f/d) in a technical degree program with a focus on electrical engineering, automation technology, mechanical engineering, mechatronics, process engineering, technical physics or similar.
We look forward to your application!
Contact person : Ulrike Meckert
Apply now
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Start your career in the semiconductor industry now. As an international microchip manufacturer from Erfurt, we offer you future-oriented topics and responsible tasks. With 45 nations on 3 continents, we rely on specialized knowledge in microchip manufacturing. Become part of our X-FABulous team!
Your Role
Would you like to complete a (mandatory) internship in a technical environment or do you need support with your thesis (Bachelor, Master)?
X-FAB's process engineering team in Erfurt/Germany will be the right place for you:
Topic 1: RIE nitride process optimization
During pore etching, holes are etched into the nitride membrane. The etching must stop on the underlying oxide. If the oxide is over-etched, it is no longer possible to process the wafer further and the wafer is scrapped.
The existing process is to be optimized in a series of tests.
The processor is to determine the remaining nitride/oxide thickness and the etching dimension with various parameter changes on some test wafers in order to evaluate his experiments.
Goal
- Improvement of homogeneity
- More selective etching: silicon nitride to silicon dioxide
- Etching dimension (lateral) should remain the same
- Gas quantities
- RF power
- Pressure ranges
- Etching times
You are an enrolled student (m/f/d) in a technical degree program with a focus on electrical engineering, automation technology, mechanical engineering, mechatronics, process engineering, technical physics or similar.
- Basic knowledge of automation technology and logistics
- Good handling of databases
- Basic knowledge of project work desirable
- Good written and spoken German (at least B2) and English skills
- International and open environment
- Specialized expertise
- Cross-departmental cooperation
- Very good transport connections & free parking spaces
- Free drinks on site and much more.
We look forward to your application!
Contact person : Ulrike Meckert
Apply now
Back to list
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